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4,6,8, ..., 18層のスタックアップ多層層圧構造

インスタント見積もりとオンライン注文

4+6+4 HDI stackup Layer buildup/stackup reference

4+6+4 HDI PCB stackup

In the layer structure of a PCB board, there are several important concepts.
PP (Prepreg): Prepreg is a semi-cured sheet, also known as prepreg material, a thin sheet material that impregnated with resin and cured to an intermediate degree. It is mainly used as the bonding material and insulation material for inner conductive patterns of multilayer printed circuit boards. After being laminated with Prepreg, the semi-cured epoxy resin is squeezed out, begins to flow, and solidifies, bonding the multilayer circuit boards together and forming a reliable insulating layer. In the PCB industry, Prepreg can be likened to glue, used to bond several cores together using the lamination method to create multilayer boards.
PP Type:1080(3.1mil), 3313(4.2mil), 2116(5.4mil), 7628(7.7mil).

Core: Core is a rigid material with specific thickness and copper on both sides.
The pressing materials for multilayer boards mainly consist of Prepreg and Core.

The differences between the two are:
- Prepreg is a material used in PCBs, with a semi-solid texture similar to cardboard, while core is a rigid material similar to copper.
- Prepreg functions as both an adhesive and insulator, whereas core serves as the foundational material for PCBs, with entirely different functional roles.
- Prepreg can be flexible, while core cannot be bent.
- Prepreg is non-conductive, whereas core has copper layers on both sides, serving as the conductive medium for the printed circuit board.

In other special cases or Advanced PCBs (you need to choose "Customized Services and Advanced Options" and Custom stackup or Impedance control):
1. If you need custom stackup or control impedance, we will manufacture according to your requirement.
2. After place order,we will calculate whether it meets the requirements based on the stackup , material and impedance information.Also we will confirm with you.

For flexible PCB stackup, please check "Stack-up for FPC".

For rigid PCB, in response to customer demand, PCBWay has added a variety of laminate structures to our products (currently, we have added 298 and will continue to update them), which can greatly satisfy product structural design and impedance requirements.

基板製造基準

基板製造基準
優品基板のケーパビリティ
多層層圧構造
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私達のカスタマーサービス
あなたのPCBの準備ができて

+86-571-85317532
1.69GHz (1.7GHz) 2x2 patch array antenna for L-band satellite reception

Designed for L-band satellite reception using the designated FR-4 from PCBWay. Manufactured antenna nicely matches the simulated performance!

Boesen

Fragaria27 keyboard

Perfect work as always, thanks for bringing the project to life.

Gzowski

PCB standard stackup Total: 298
Layers
  • Please Select
  • 4 Layers
  • 6 Layers
  • 8 Layers
  • 10 Layers
  • 12 Layers
  • 14 Layers
  • 16 Layers
  • 18 Layers
Thickness (MM)
  • Please Select
  • 0.4MM
  • 0.6MM
  • 0.8MM
  • 1.0MM
  • 1.2MM
  • 1.6MM
  • 2.0MM
  • 2.4MM
Inner Copper (OZ)
  • Please Select
  • 0.5OZ
  • 1OZ
  • 1.5OZ
  • 2OZ
  • 3OZ
  • 4OZ
  • 5OZ
Outer Copper (OZ)
  • Please Select
  • 1OZ
  • 2OZ
  • 3OZ
  • 4OZ
  • 5OZ
Inner layer Residual copper ratio (%)
  • Please Select
  • 90%
  • 70%
  • 50%
  • 30%
検索
リセット
Friendly Reminder: This is a through-hole board stack-up, not applicable for blind and buried vias. PCBWay supports customers to customize structures, and will continue to increase the structure diagrams.
4 Layers Total: 112
View all
1 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 1.1
(Core with Cu)
CORE Core
DK:4.6 		1.0300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L4-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 1.1
(Core with Cu)
CORE Core
DK:4.6 		1.0300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L4-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L2-CU Inner Copper 1OZ 0.0350 1.1
(Core with Cu)
CORE Core
DK:4.6 		1.0300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L4-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L4-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L4-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L4-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

SHOW MORE
6 Layers Total: 74
View all
1 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L6-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

4 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.2250
PP 2116 RC58%
DK:4.45 		0.1300
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L6-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.56mm, tolerance: ±10%

Finished PCB Thickness: 1.66mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

5 6-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L4-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

6 6-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.9
(Core with Cu)
CORE Core
DK:4.6 		0.8300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.9
(Core with Cu)
CORE Core
DK:4.6 		0.8300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.35mm, tolerance: ±10%

Finished PCB Thickness: 2.45mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

SHOW MORE
8 Layers Total: 49
View all
1 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L8-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

4 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

5 8-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

6 8-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

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10 Layers Total: 33
View all
1 10-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 10-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 10-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 10-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L9-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 10-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L9-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 10-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L4-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L6-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L8-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

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12 Layers Total: 12
View all
1 12-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 12-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 12-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0785
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0785
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 12-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L11-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 12-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L11-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 12-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L8-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L9-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L10-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

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14 Layers Total: 6
View all
1 14-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 14-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1935
PP 2116 RC58%
DK:4.45 		0.1300
L2-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1935
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 14-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.2085
PP 2116 RC58%
DK:4.45 		0.1300
L2-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L12-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.2085
PP 3313 RC58%
DK:4.45 		0.1030
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 14-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.97mm, tolerance: ±10%

Finished PCB Thickness: 2.07mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 14-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 14-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

16 Layers Total: 6
View all
1 16-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L14-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 16-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1760
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1760
PP 2116 RC58%
DK:4.45 		0.1300
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L14-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.39mm, tolerance: ±10%

Finished PCB Thickness: 2.49mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 16-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 16-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 16-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1760
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1760
PP 2116 RC58%
DK:4.45 		0.1300
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 16-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

18 Layers Total: 6
View all
1 18-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L14-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L16-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L17-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 18-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1935
PP 2116 RC58%
DK:4.45 		0.1300
L2-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L14-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L16-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L17-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1935
PP 1080 RC68%
DK:4.21 		0.0810
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 18-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L2-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L3-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L4-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L5-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L6-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L7-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L10-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L11-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L12-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L13-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L15-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L16-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L17-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 18-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L16-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L17-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 18-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 0.5OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1213
L2-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L4-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L6-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L10-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L12-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L14-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L16-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L17-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1213
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 18-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L16-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L17-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

  • 4 Layers
  • 6 Layers
  • 8 Layers
  • 10 Layers
  • 12 Layers
  • 14 Layers
  • 16 Layers
  • 18 Layers
Front-end data preparation

01.PPE - プリプロダクションエンジニアリング

顧客提供のデータ（ガーバー）を使用して、特定のPCBの製造データ（イメージングプロセス用のアートワークおよび穿孔プログラム用のドリルデータ）を作成します。 エンジニアは要求/仕様を機能と比較してコンプライアンスを確保し、さらにプロセスステップと関連するチェックを決定します。 PCBWay Groupの許可なしに変更することはできません。

Preparing

02.Board Cutting (Copper Clad Laminate Cutting)

PCB production starts with a large piece of sheet material. Due to the limitations of PCB production equipment and manufacture capabilities, the factory has requirements for its minimum and maximum processing size. Therefore, under the guidance of manufacture instruction (MI), the raw material of PCB (Copper Clad Laminate ) needs to be cut into the processing size by automatic cutting machine before production.

print icon

03.内層印刷

段階１は、アートワークフィルムを用いて感光性ドライフィルムおよびＵＶ光を用いてボード表面に画像を転写することであり、これはアートワークによって露光されたドライフィルムを重合する。 プロセスのこのステップはクリーンルームで行われます。<br> イメージング - 電子データをフォトプロッタに転送するプロセス。フォトプロッタは、光を使用してネガティブ画像回路パターンをパネルまたはフィルムに転送します。

etch icon

04.エッチング内層

段階２は、エッチングを用いてパネルから不要な銅を除去することである。 この銅が取り除かれると、残りのドライフィルムは取り除かれ、デザインに合った銅回路が残ります。 エッチング - 導電性または抵抗性の材料の不要な部分を化学的、または化学的および電解的に除去すること。

aoi icon

05.内層自動光学検査（AOI）

回路が設計と一致し、欠陥がないことを確認するためのデジタル「画像」に対する回路の検査。 ボードのスキャンによって達成され、それから訓練された検査官はスキャンプロセスが強調したどんな異常でも確かめるでしょう。 PCBWayグループは開回路の修理を許可しません。

Lamination icon

06.Lay-up and bond (Lamination)

内層には酸化物層が塗布され、次いで層間を絶縁するプリプレグと共に「積み重ね」られ、銅箔が積み重ねの上下に加えられる。 積層工程は、感光性ドライレジストと積層しながら、内層を極端な温度（３７５°Ｆ）および圧力（２７５から４００ｐｓｉ）下に置くことからなる。 ＰＣＢを高温で硬化させ、圧力をゆっくり解放し、次いで材料をゆっくり冷却する。

drilling icon

07.Drilling the PCB

私達は今多層PCBの中で電気接続を後で作成する穴をあけなければならない。 これは、すべての内層接続に対して位置合わせを行うことができるように最適化する必要がある機械的穴あけプロセスです。 この工程でパネルを積み重ねることができる。 穴あけはまたレーザーのドリルによってすることができます

copper icon

08.無電解銅めっき

めっきプロセスの最初のステップは、穴の壁に銅の非常に薄い層を化学蒸着することです。
PTHは穴の壁とパネル全体を覆う非常に薄い銅の堆積物を提供します。 信頼性の高い銅の析出物を非金属製の穴の壁にもメッキできるように厳密に制御する必要がある複雑な化学プロセス。 それ自体では十分な量の銅ではないが、我々は今や層間と孔を通して電気的に連続している。パネルめっきはＰＴＨ堆積物の上により厚い銅堆積物、典型的には５〜８μｍを提供するために続く。 この組み合わせは、トラックおよびギャップの要求を達成するために、メッキおよびエッチングされる銅の量を最適化するために使用されます。

image icon

09.外層をイメージする

内層プロセス（感光性ドライフィルムを使用した画像転写、UV光への露光、エッチング）と似ていますが、主な違いが1つあります - 銅/定義回路を残したい部分でドライフィルムを削除します。 プロセスの後半で銅。
プロセスのこのステップはクリーンルームで行われます。

Plating icon

10.メッキ

追加のめっきがドライフィルム（回路）のない領域に堆積される第二の電解めっき段階。 銅がメッキされると、メッキされた銅を保護するためにスズが塗布されます。

etch icon

11.エッチング外層

これは通常3段階のプロセスです。 最初のステップは青いドライフィルムを取り除くことです。 2番目のステップは、露出した/不要な銅をエッチング除去する一方で、スズの堆積物が必要な銅を保護するエッチレジストとして機能するようにすることです。 最後の3番目のステップは、回路を離れる錫メッキを化学的に除去することです。

AOI

12.外層AOI

内層ＡＯＩの場合と全く同様に、画像形成されエッチングされたパネルは、回路が設計を満たし、それが欠陥がないことを確実にするために走査される。 PCBWayの要求により、開回路の修理はできません。

Soldermask

13.レジスト印刷

ソルダーマスクインキはPCB表面全体に塗布されます。 アートワークとUV光を使用して、特定の領域をUVにさらし、露光されていない領域（通常ははんだ付け可能な表面として使用される領域）を除去します。 残りのソルダーマスクはそれから完全に硬化されてそれを弾力のある仕上げにする。 プロセスのこのステップはクリーンルームで行われます。

Surface finish

14.表面処理

次いで、露出した銅領域に様々な仕上げが施される。 これは表面の保護と良好なはんだ付け性を可能にするためです。 さまざまな仕上げには、無電解ニッケル液浸金、HASL、液浸銀などがあります。厚さとはんだ付け性のテストは常に行われます。

Profile

15.プロフィール

これは、ガーバーデータで定義されている顧客の設計に基づいて、製造パネルを特定のサイズと形状に切断するプロセスです。 配列を提供したりパネルを売ったりするときに利用できる3つの主なオプションがあります - 得点、ルーティングまたはパンチ。 すべての寸法は、パネルの寸法が正しいことを確認するために、お客様から提供された図面に対して測定されます。

Electrical test

16.電気テスト

トラックとスルーホールの相互接続の完全性をチェックするために使用されます - 完成したボード上に開回路や短絡がないことを確認するためにチェックします。 2つのテスト方法があります。小体積用のフライングプローブと体積用のフィクスチャです。すべてのPCBを元のボードデータと電気的にテストします。 フライングプローブテスターを使用して、各ネットをチェックして、ネットが完全であり（開回路がない）、他のネットと短絡していないことを確認します。

inspection

17.最終検査

プロセスの最後のステップでは、鋭い目の検査官のチームが各PCBに最終の慎重なチェックオーバーを行います。合格基準に照らしてPCBを視覚的に検査し、PCBWay「承認」検査員を使用します。 手動の目視検査とAVIを使用する - PCBとガーバーを比較し、人間の目より速いチェック速度を持ちますが、それでも人間による検証が必要です。 すべての注文は寸法、はんだ付け性などを含む完全な検査も受けます。

Packaging

18.包装

ボードは、PCBWayパッケージング要求（ESDなど）に適合する材料を使用して包装され、要求された輸送モードを使用して出荷される前に箱詰めされます。

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