基板クイック試作
カスタム基板試作サービス
基板クイック試作
カスタム基板試作サービス
The 7th-order HDI board is widely used in high-end smart phones and other fields
Number of Layers:2-8 Layers, Board Thickness/Copper Thickness:1.2-2.0mm/35um
Process Characteristics:High Density P1.25 - P2.5
Surface Treatment:OSP/HAL/HASL(LF), Breakdown Voltage:1.0-3.0KV(DC)
Thermal Conductivity:1.0-3.0W/m.k, Breakdown Voltage:1.0-3.0KV(DC)
Board Thickness/Copper Thickness: 2.0mm/70um
Thermal Conductivity:1.0-5.0W/m.k, Surface Treatment:HAL/OSP/HASL(LF)
Thermal Conductivity:1.0-3.0W/m.k, Breakdown Voltage:1.0-3.0KV(DC)
Board Thickness/Copper Thickness:2.0mm/70um
Min Line Width/Spacing:3/3mil, Products used in Industrial control
Max Aperture Ratio:13:1, Thickness is dissymmetry
Min Line Width/Spacing:3/3mil, Products used in industrial control
Min Hole:0.20mm, Products used in Medical electronic
Min Line Width/Spacing:3/3mil, Products used in Industrial control
Min Hole:0.25mm, Products used in Industrial control
Min Line Width/Spacing:3/3.5mil, Products used in Spend products
Min Hole:0.20mm, Products used in Medical electronic
Min Line Width/Spacing:3/3mil, Products used in Industrial control
Thickness:2.00mm, Multilayer and stratified
Min Line Width/Spacing:3/3mil, Products used in Industrial control
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Designed for L-band satellite reception using the designated FR-4 from PCBWay. Manufactured antenna nicely matches the simulated performance!
Boesen
Perfect work as always, thanks for bringing the project to life.
Gzowski
