BGA Assembly Capabilities

When it comes to BGA assembly, let's first understand what BGA is. BGAs (Ball Grid Arrays) are a type of IC package where the pins are placed in the form of solder balls. Compared to traditional packaging technologies such as DIP (Dual In-line Package) or QFP (Quad Flat Package), BGA employs a higher-density pin layout.

Now let's watch the video below to learn more about BGA packaging.

With technological advancements, there is an increasing demand in PCB design for complex and small-sized chips. These chips enable higher integration and functionality within smaller spaces. Hence, there is a need for a packaging method that can accommodate these chips with higher I/O density while maintaining cost-effectiveness. BGA (Ball Grid Array) is precisely such a packaging method that meets these requirements.

What is BGA Assembly?

BGA assembly refers to the process of mounting a Ball Grid Array (BGA) onto a PCB using the reflow soldering technique. BGA is a surface-mounted component that utilizes an array of solder balls for electrical interconnection. As the circuit board passes through a solder reflow oven, these solder balls melt, forming electrical connections.

Steps of BGA Assembly

The BGA assembly process typically involves the following steps:

• PCB Preparation: The PCB is prepared by applying solder paste to the pads where the BGA will be mounted. The solder paste is a mixture of solder alloy particles and flux, which helps with the soldering process.

• Placement of BGAs: The BGAs, which consist of the integrated circuit chip with solder balls on the bottom, are placed onto the prepared PCB. This is typically done using automated pick-and-place machines or other assembly equipment.

• Reflow Soldering: The assembled PCB with the placed BGAs is then passed through a reflow oven. The reflow oven heats the PCB to a specific temperature that melts the solder paste, causing the solder balls of the BGAs to reflow and establish electrical connections with the PCB pads.

• Cooling and Inspection: After the solder reflow process, the PCB is cooled down to solidify the solder joints. It is then inspected for any defects, such as misalignment, shorts, or open connections. Automated optical inspection (AOI) or X-ray inspection may be used for this purpose.

• Secondary Processes: Depending on the specific requirements, additional processes such as cleaning, testing, and conformal coating may be performed after BGA assembly to ensure the reliability and quality of the finished product.

Advantages of BGA Assembly

• Small footprint

BGA packaging consists of the chip, interconnects, a thin substrate, and an encapsulation cover. There are few exposed components and the package has a minimal number of pins. The overall height of the chip on the PCB can be as low as 1.2 millimeters.

• Robustness

BGA packaging is highly robust. Unlike QFP with a 20mil pitch, BGA does not have pins that can bend or break. Generally, BGA removal requires the use of a BGA rework station at high temperatures.

• Lower parasitic inductance and capacitance

With short pins and low assembly height, BGA packaging exhibits low parasitic inductance and capacitance, resulting in excellent electrical performance.

• Increased storage space

Compared to other packaging types, BGA packaging has only one-third of the volume and approximately 1.2 times the chip area. Memory and operational products using BGA packaging can achieve more than a 2.1-fold increase in storage capacity and operational speed.

• High stability

Due to the direct extension of pins from the center of the chip in BGA packaging, the transmission paths for various signals are effectively shortened, reducing signal attenuation and improving response speed and anti-interference capabilities. This enhances the stability of the product.

• Good heat dissipation

BGA offers excellent heat dissipation performance, with the chip temperature approaching the ambient temperature during operation.

• Convenient for rework

The pins of BGA packaging are neatly arranged on the bottom, making it easy to locate damaged areas for removal. This facilitates the rework of BGA chips.

• Avoidance of wiring chaos

BGA packaging allows for placing many power and ground pins in the center, with I/O pins positioned on the periphery. Pre-routing can be done on the BGA substrate, avoiding chaotic wiring of I/O pins.

PCBWay BGA Assembly Capabilities

PCBWay is a globally renowned manufacturer for PCB fabrication and PCB assembly. BGA assembly service is one of the many service types we offer. PCBWay can provide you with high-quality and cost-effective BGA assembly for your PCBs. The minimum pitch for BGA assembly that we can accommodate is 0.25mm  0.3mm.. We offer PCB fabrication and assembly services containing the following BGA types:

• Plastic BGA (PBGA)

• Ceramic BGA (CBGA)

• Micro BGA

• Micro Fine Line BGA (MBGA)

• Stack BGAs

• Lead BGA and leadless BGA

As a PCB service provider with over a decade of experience in PCB manufacturing, fabrication and assembly, PCBWay has a rich background. If there is a demand for BGA assembly, please feel free to contact us！

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