Automotive communication 2nd-order HDI board

基板製品 / HDI PCB / Automotive communication 2nd-order HDI board

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Applications

Car communication

Features

2 times laser drilling, 3 times pressing, 2nd order HDI board

Material

Layers

14 Layers

Thickness

1.6±0.16mm

Min Hole Size

Laser hole 0.10mm; mechanical hole 0.20mm

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

8:1

Surface Finish

OSP

今すぐお見積もり

製品詳細

The 2nd-order HDI board for automobile communication is manufactured by using Shengyi S1000-2M material immersion gold surface finish, laser drilling and other processes. The circuit board is widely used in the field of automotive communication.

基板製造基準

優品基板のケーパビリティ

多層層圧構造

クイックターン基板製作

基板試作

少量生産

生産工程

基板製品

基板のよくある質問

アセンブリ基準

PCB実装能力

特別なお知らせ

ファイル必要条件

PCBアセンブリFAQ

生産工程

PCBアセンブリ製品

お問い合わせ!

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FENIX v0.5

Excellent service, support with file queries, appropriate solutions that facilitate development work. We are very grateful for the attention given to this and other projects manufactured with PCBWay.

C.A.

Placa de comando

After manufacturing the board correctly, the team contacted me with an assembled prototype to confirm the assembly method. I thought that was amazing. After confirming my part of the assembly, the team proceeded with the production process and assembled the boards in a very professional manner. Congratulations!

Engineer

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