Number of Layers:2-8 Layers, Board Thickness/Copper Thickness:1.2-2.0mm/35um
Process Characteristics:High Density P1.25 - P2.5
Surface Treatment:OSP/HAL/HASL(LF), Breakdown Voltage:1.0-3.0KV(DC)
Thermal Conductivity:1.0-3.0W/m.k, Breakdown Voltage:1.0-3.0KV(DC)
Board Thickness/Copper Thickness: 2.0mm/70um
Thermal Conductivity:1.0-3.0W/m.k, Breakdown Voltage:1.0-3.0KV(DC)
Board Thickness/Copper Thickness:2.0mm/70um