基板クイック試作

カスタム基板試作サービス

弊社製プリント基板の例

私達は簡単なものから複雑なベアボードを作るためのPCB製造能力を持っています。
下記のプリント回路例をご覧になり、ご質問がある場合やフォームの見積もりをご希望の場合はお知らせください。

  • FPC laminated structure (flex pcb)

    The highest 16-layer Rigid-flex PCB processing technology

  • FPC-Structure (1+2F+1)

    Surface Finish: ENIG + Silver Paste, Structure:1+2F+1

  • Mobile Display & Side Keys_3

    Surface Finish:Immersion gold, Structure:1+2F+1

  • Mobile Display & Side Keys_2

    Rigid-Flex Thickness: 0.295 +/- 0.052mm, Structure:1+2F+1

  • Camera Module

    4 layers, Structure:(1+2F+1) HDI

  • Mobile Display & Side Keys

    4 layered HDI with Buried holes, Structure:1-{(2)}-1

  • Mobile Bluetooth & USB

    0.6mm total thickness, Structure:1-2F-1

  • Telecom-8 layered Rigid flex

    8 layers, Structure:(2+1+2F+1+2) HDI

  • 6 layered Rigid flex

    6 layers, Structure:1+1+2F+1+1

  • FPC 2 layers

    2 layers, Material: PI, silver film, Thickness: 0.1mm

  • FPC 7 layers

    7 layers, Material: PI, FR-4, Thickness: 0.45mm

  • FPC 4 layers -Thickness:1.6mm

    4 layers, Material: PI, FR-4, Thickness: 1.6mm

  • FPC 10 layers

    10 layers, Material: PI, FR-4, Grosor: 2.0mm

  • FPC 12 layers

    12 layers, Material: PI, FR-4, Thickness: 1.6mm

  • FPC 4 layers -Thickness:0.2mm

    4 layers, Material: PI, Thickness: 0.2mm

  • FPC 4 layers

    4 layers, Material: PI, Thickness: 0.8mm

  • HDI first-order 8-layer HASL

    8 layers, Surface Finish: HASL

  • HDI second-order 6-layer immersion gold

    6 layers, Surface Finish: immersion gold

  • HDI third-order 6-layer immersion gold

    6 layers, Surface Finish: immersion gold

  • HDI second-order 12-layer immersion gold

    12 layers, Surface Finish: immersion gold

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