基板クイック試作

カスタム基板試作サービス

弊社製プリント基板の例

私達は簡単なものから複雑なベアボードを作るためのPCB製造能力を持っています。
下記のプリント回路例をご覧になり、ご質問がある場合やフォームの見積もりをご希望の場合はお知らせください。

  • Semiconductor test PCB

    8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm

  • 5G Internet of Things PCB

    8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

  • 5G signal test PCB

    4 layers, Material: RO4350B+TU768, Thickness: 1.6mm

  • 5G mobile phone PCB motherboard

    12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • Mobile phone 3rd-order HDI board

    12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • Automotive communication 2nd-order HDI board

    14 layers, Thickness: 1.6±0.16, Surface Finish: OSP

  • Industrial control 5th-order HDI board

    12 layers, Material: S1000-2M, Thickness: 1.8±0.18m

  • Semiconductor test 4th-order HDI board

    8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm

  • Ipad 3rd-order HDI board

    8 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • 10-layer 2nd-order HDI board

    10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm

  • 6th-order arbitrary interconnection HDI buried/blind via circuit board

    14 layers, Material: S1000-2M, Thickness: 1.6±0.1mm

  • 4th-order HDI buried/blind via board

    10 layers, Material: S1000-2M, Thickness: 2.2±0.2mm

  • 3rd-order HDI board

    8 layers, Material: A1000-2M, Thickness: 2.5±0.25mm

  • 3rd-order HDI PCB buried resistor circuit board

    8 layers, Material: R5775G+IT180, Thickness: 2.0±0.2mm

  • 3rd-order 5G IoT HDI PCB

    8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

  • 2nd-order high speed PCB

    18 layers, Material: RO4350B+TU872SLK Rogers, Thickness: 3.2±0.32mm

  • 2nd-order HDI buried/blind via board

    22 layers, Material: TU-883, Thickness: 1.6±0.16mm

  • 2nd-order HDI test board

    10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm

  • PCB Design and Layout

    PCB design file errors and solutions

  • FPC/R-FPC

    Flexible Part Circuit Design Requirements

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