PCBWay factories will have one day off on Mid-Autumn Festival Sept 17th. Orders can be placed as usual during holidays, but all orders will be delayed by 1-2 days.

基板クイック試作

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Peelable solder mask is a temporary protective film used in the manufacturing process of printed circuit boards (PCBs), also known as blue solder mask. It is primarily used to protect specific areas during soldering and surface treatment processes, preventing these areas from being contaminated or damaged by solder or other chemicals. Unlike the solder mask in PCB design, which is applied as a negative image and permanently covers the PCB, peelable solder mask is used temporarily during PCB manufacturing and assembly.

Peelable_soldermask.png

PCB with peelable soldermask

Features and Advantages

1. Easy to Peel Off: Peelable solder mask can be easily removed from the circuit board after completing its protective task, leaving no residue and ensuring the board remains clean and intact.

2. High Temperature Resistance: This material can withstand the high temperatures generated during soldering, ensuring effective protection of the circuit board in high-temperature environments.

3. Good Chemical Stability: It can resist various chemicals, ensuring the circuit board is protected from corrosion or contamination during plating or other chemical processes.

4. Easy to Apply: Peelable solder mask is typically available in liquid or paste form and can be conveniently applied to specific areas of the circuit board through methods such as screen printing or spraying.

Application Areas

1. Selective Soldering: Using peelable solder mask in areas requiring selective soldering can prevent solder from flowing into unwanted areas.

2. Protection of Sensitive Areas: Protecting sensitive areas of the circuit board, such as plugs, sockets, and other connector regions, during plating or chemical processing, to avoid chemical corrosion or physical damage.

3. Multiple Process Protection: Ensuring that critical areas of the circuit board are protected during each processing step in multiple manufacturing processes.

最終更新日 30/07/2024
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