基板クイック試作
カスタム基板試作サービス
基板クイック試作
カスタム基板試作サービス
The 5G mobile phone PCB motherboard is made of Shengyi S1000-2M material through surface immersion gold, laser drilling and OSP processes. This type of HDI circuit board is widely used in the field of smart phones.
4 layers, Thickness: 1.12mm, Surface Finish: HASL lead free
2 layers, Thickness: 1.2mm
2 layers, Thickness: 1.6mm, Surface Finish: Immersion gold(ENIG)
6 layers, Thickness: 1.6mm, Surface Finish: Immersion gold(ENIG)
6 layers, Thickness: 2.6mm, Size: 6*6cm
10 layers, Material: FR4, Thickness: 1.6mm
6 layers, Thickness: 1.0mm, Surface Finish: Immersion gold(ENIG) 3U"
12 layers, Material: FR4, Thickness: 1.6mm
4 layers, Thickness: 0.8mm, Surface Finish: Immersion gold(ENIG)
6 layers, Thickness: 1.6mm, Surface Finish: Immersion gold(ENIG)
8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm
4 layers, Material: RO4350B+TU768, Thickness: 1.6mm
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私達のカスタマーサービス+86-571-85317532
I ordered the PCB just last week, and it arrived in only six days—much faster than I expected. The production process was without any problems, and there were absolutely no issues during manufacturing or delivery. The quality of the board looks excellent, and it matches my design perfectly. This PCB will be invaluable for confirming all the details before committing to the full production run. I'm genuinely impressed with the speed and reliability of the service, and I’m excited to start working with it to validate my project. This quick turnaround has saved me a lot of time and effort in my development process.
Ullrich
Perfect work as always, thanks for bringing the project to life.
Gzowski
