基板クイック試作

カスタム基板試作サービス

弊社製プリント基板の例

私達は簡単なものから複雑なベアボードを作るためのPCB製造能力を持っています。
下記のプリント回路例をご覧になり、ご質問がある場合やフォームの見積もりをご希望の場合はお知らせください。

原图
Mouse over to zoom in

5G signal test PCB

Applications
5G signal test
Features
/
Material
RO4350B+TU768
Layers
4 Layers
Thickness
1.6mm
Min Hole Size
/
Min Track/Spacingh
100/100um
Minimum board thickness and hole ratio
/
Surface Finish
Immersion gold(ENIG) 0.05um
今すぐお見積もり
製品詳細

5G signal test PCB board, this type of circuit board is made of RO4350B+TU768 material, produced by mixed pressure, mechanical drilling, surface immersion gold and other processes, the smallest aperture can reach 0.2mm, the Min Track/Spacing can reach 100/100um . The PCB circuit board is widely used in the field of 5G signal testing.

RF-antenna-PCB-board-1-1.jpg

Related Products もっと見る >>
  • Communication 4-layer PCB

    4 layers, Thickness: 1.12mm, Surface Finish: HASL lead free

  • Double-sided communication high frequency PCB

    2 layers, Thickness: 1.2mm

  • Rogers PCB

    2 layers, Thickness: 1.6mm, Surface Finish: Immersion gold(ENIG)

  • HDMI circuit board

    6 layers, Thickness: 1.6mm, Surface Finish: Immersion gold(ENIG)

  • High frequency and high speed PCB

    6 layers, Thickness: 2.6mm, Size: 6*6cm

  • High-level impedance PCB

    10 layers, Material: FR4, Thickness: 1.6mm

  • Half-hole module PCB

    6 layers, Thickness: 1.0mm, Surface Finish: Immersion gold(ENIG) 3U"

  • 12-layer impedance PCB

    12 layers, Material: FR4, Thickness: 1.6mm

  • 5G module PCB

    4 layers, Thickness: 0.8mm, Surface Finish: Immersion gold(ENIG)

  • 5G Immersion Gold PCB

    6 layers, Thickness: 1.6mm, Surface Finish: Immersion gold(ENIG)

  • 5G Internet of Things PCB

    8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

  • 5G mobile phone PCB motherboard

    12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm