3rd-order 18-layer buried/blind via PCB

基板製品 / High-level PCB / 3rd-order 18-layer buried/blind via PCB

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Applications

Chip testing field

Features

3 times laser drilling, 4 times pressing

Material

S1000-2M

Layers

18 Layers

Thickness

2.1±0.21mm

Min Hole Size

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

11:1

Surface Finish

今すぐお見積もり

製品詳細

3rd-order 18-layer buried/blind via PCB, mainly used in the field of chip testing.

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優品基板のケーパビリティ

多層層圧構造

クイックターン基板製作

基板試作

少量生産

生産工程

基板製品

基板のよくある質問

アセンブリ基準

PCB実装能力

特別なお知らせ

ファイル必要条件

PCBアセンブリFAQ

生産工程

PCBアセンブリ製品

お問い合わせ!

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+86-571-85317532

Project OBI board

Absolute spot on. Can’t complain about the accuracy and how quick getting the boards delivered for this project. The build continues, thanks PCBWay ;)

Reilly

Vehicle IO slave board assembly

My first attempt at a custom PCB, and I am honestly blown away. If you're considering taking the next step past a breadboard, just do it! Download KiCad for free and spend some hours arguing with an AI. Totally worth it. I opted for a fully assembled PCB and I am really amazed by the results. The communication was great too! Very rewarding and highly recommended

Engineer

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