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弊社製プリント基板の例

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14-layer high-thickness-to-diameter ratio semiconductor test thick gold PCB

Applications
Semiconductor test
Features
/
Material
S1000-2M
Layers
14 Layers
Thickness
5.0mm±0.5mm
Min Hole Size
Mechanical hole 0.35mm
Min Track/Spacingh
100/90um
Minimum board thickness and hole ratio
14:1
Surface Finish
Immersion gold(ENIG) 5u"
今すぐお見積もり
製品詳細

14-layer high-thickness-to-diameter ratio semiconductor test thick gold board, made of Shengyi S1000-2M material, thick gold plating on the surface and other production processes. The Min Track/Spacing can reach 100/90um, and the minimum mechanical hole can reach 0.35mm. Mainly used in the field of semiconductor testing, it is an ideal choice for the field of semiconductor testing.

highPCB-2-1.jpg

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